The role of copper nanoparticles in an etch-and-rinse adhesive on antimicrobial activity, mechanical properties and the durability of resin-dentine interfaces

Article

Abstract: Objectives To evaluate the effect of addition of copper nanoparticles at different concentrations in

Palabras claves:

Adhesive system, antimicrobial activity, Copper nanoparticles, Degree of conversion, Knoop microhardness, Nanoleakage, Resin-dentine bond strength

Autores:

Alessandro D. Loguercio, Farago P.V., Gutierrez M.F., Hass V., Lourenço L., Malaquias P., Matos T.P., Reis A.

Fuentes:

scopus