Mechanical and microbiological properties and drug release modeling of an etch-and-rinse adhesive containing copper nanoparticles

Article

Abstract: Objectives To evaluate the effect of addition of copper nanoparticles (CN) at different concentratio

Palabras claves:

Adhesive system, antimicrobial activity, Copper nanoparticles, Copper release, Degree of conversion, Microtensile Bond Strength, Nanoleakage, SOLUBILITY, Ultimate tensile strength, Water sorption

Autores:

Alessandro D. Loguercio, Bermúdez J.P., Farago P.V., Gutierrez M.F., Malaquias P., Matos T.P., Reis A., Souza S., Szesz A.L.

Fuentes:

scopus