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Acid etching with modified phosphoric acid to increase the longevity of the bonded interface
ArticleAbstract: Purpose: To evaluate the effect of three phosphoric acids modified with chlorhexidine (CHX), benzalkPalabras claves:Acid etching, Benzalkonium chloride, Chlorhexidine, Cross-linking agents, longevity, Metalloproteinases, Phosphoric acid, ProanthocyanidinsAutores:Alessandro D. Loguercio, Bandeca M.C., dos Santos F., Hass V., Lima S.N.L., Malaquias P., Reis A., Stanislawczuk R.Fuentes:scopusEvaluation of bond strength, marginal integrity, and fracture strength of bulk- vs incrementally-filled restorations
ArticleAbstract: Purpose: This study evaluated the effect of application technique and preparation size on the fractuPalabras claves:Direct resin composite restorations, Filling technique, Fracture strength, Marginal integrity, Microtensile Bond Strength, preparationAutores:Alessandro D. Loguercio, Bandeca M.C., Bhandi S., de Assis F., Lima S.N.L., Malaquias P., Pinto S.C.S., Tonetto M.Fuentes:scopusEffect of MDP-containing Silane and Adhesive Used Alone or in Combination on the Long-term Bond Strength and Chemical Interaction with Lithium Disilicate Ceramics
ArticleAbstract: Purpose: To evaluate the effect of a silane and an adhesive containing MDP, used alone or combined iPalabras claves:Bond strength, CAD/CAM lithium disilicate, Luting composite, Resin cement, Universal dentin adhesiveAutores:Alessandro D. Loguercio, Gutierrez M.F., Hass V., Malaquias P., Millan Cardenas A.F., Perdigao J., Reis A., Suelen Figueredo de Siqueira F.Fuentes:scopusLaboratory performance of universal adhesive systems for luting CAD/CAM restorative materials
ArticleAbstract: Purpose: To evaluate the microshear bond strength (μSBS) of several universal adhesive systems appliPalabras claves:Bond strength, CAD/CAM restorative materials, Resin cement, Universal dentin adhesiveAutores:Alessandro D. Loguercio, Gutierrez M.F., Hass V., Malaquias P., Millan Cardenas A.F., Perdigao J., Reis A., Suelen Figueredo de Siqueira F.Fuentes:scopusMechanical and microbiological properties and drug release modeling of an etch-and-rinse adhesive containing copper nanoparticles
ArticleAbstract: Objectives To evaluate the effect of addition of copper nanoparticles (CN) at different concentratioPalabras claves:Adhesive system, antimicrobial activity, Copper nanoparticles, Copper release, Degree of conversion, Microtensile Bond Strength, Nanoleakage, SOLUBILITY, Ultimate tensile strength, Water sorptionAutores:Alessandro D. Loguercio, Bermúdez J.P., Farago P.V., Gutierrez M.F., Malaquias P., Matos T.P., Reis A., Souza S., Szesz A.L.Fuentes:scopus