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Effect of self-curing activators and curing protocols on adhesive properties of universal adhesives bonded to dual-cured composites
ArticleAbstract: Objectives To measure microshear bond strength (μSBS) and nanoleakage (NL) of self-etch universal adPalabras claves:Buildup composites, Microshear bond strength, Nanoleakage, Self-cured activator, universal adhesivesAutores:Alessandro D. Loguercio, De Paris Matos T., de Souza L.M., Gutierrez M.F., Malaquias P., Perdigao J., Reis A., Sutil E.Fuentes:scopusMechanical and microbiological properties and drug release modeling of an etch-and-rinse adhesive containing copper nanoparticles
ArticleAbstract: Objectives To evaluate the effect of addition of copper nanoparticles (CN) at different concentratioPalabras claves:Adhesive system, antimicrobial activity, Copper nanoparticles, Copper release, Degree of conversion, Microtensile Bond Strength, Nanoleakage, SOLUBILITY, Ultimate tensile strength, Water sorptionAutores:Alessandro D. Loguercio, Bermúdez J.P., Farago P.V., Gutierrez M.F., Malaquias P., Matos T.P., Reis A., Souza S., Szesz A.L.Fuentes:scopusMechanical properties and modeling of drug release from chlorhexidine-containing etch-and-rinse adhesives
ArticleAbstract: Objectives To evaluate the effects of chlorhexidine (CHX) addition in different concentrations intoPalabras claves:Adhesives systems, Chlorhexidine, Chlorhexidine release, SOLUBILITY, Ultimate tensile strength, Water sorptionAutores:Alessandro D. Loguercio, Farago P.V., Malaquias P., Meier M.M., Pereira F., Reis A., Stanislawczuk R.Fuentes:scopus