Mostrando 4 resultados de: 4
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Applied Clay Science(1)
Critical Reviews in Food Science and Nutrition(1)
Journal of Food Engineering(1)
Molecules(1)
Cetylpyridinium bromide-modified montmorillonite as filler in low density polyethylene nanocomposite films
ArticleAbstract: The development of clay polymer nanocomposites has been presented as an interesting alternative forPalabras claves:Cetylpyridinium bromide, MIGRATION, Montmorillonite, nanocomposites, PolyethyleneAutores:Bruna J.E., Cristina Muñoz-Shugulí, Favaro Perez M.A., Galotto M.J., Padula M., Rodríguez F.J., Sarantópoulos C.Fuentes:googlescopusDevelopment and Evaluation of the Properties of Active Films for High-Fat Fruit and Vegetable Packaging
ArticleAbstract: β-cyclodextrin and allyl isothiocyanate inclusion complexes (β-CD:AITC) have been proposed for develPalabras claves:active compound release, active food packaging, allyl isothiocyanate, Cyclodextrin, Fickian diffusion, inclusion complex, poly(lactic acid), surface propertiesAutores:Benbettaieb N., Cristina Muñoz-Shugulí, Debeaufort F., Galotto M.J., Guarda A., Rodríguez-Mercado F.Fuentes:googlescopusElectrospinning and cyclodextrin inclusion complexes: An emerging technological combination for developing novel active food packaging materials
ReviewAbstract: This review was focused on describing the combination of electrospinning and cyclodextrin inclusionPalabras claves:Antimicrobial, antioxidant, Encapsulation, Fiber, food shelf-lifeAutores:Cristina Muñoz-Shugulí, Galotto M.J., Guarda A., López-De-Dicastillo C., Rodríguez-Mercado F., Vidal C.P.Fuentes:googlescopusModeling the release of an antimicrobial agent from multilayer film containing coaxial electrospun polylactic acid nanofibers
ArticleAbstract: The research of active biodegradable multilayer materials are of current interest for developing funPalabras claves:active packaging, Chitosan, Coating, Electrospinning, Polylactic acidAutores:Cristina Muñoz-Shugulí, Galotto M.J., Gavara R., Hernández-Muñoz P., López-De-Dicastillo C., Velásquez E., Vidal C.P.Fuentes:googlescopus