Optimization of rear point contact geometry by means of 3-D numerical simulation

Conference Object

Abstract: In this work three-dimensional (3-D) numerical simulations, validated by the experimental measuremen

Palabras claves:

3-D device simulation, Electro-plated Cu contacts, High sheet resistance emitter, PERC, Si solar cells

Autores:

Das J., De Castro A.U., Dross F., Fiegna C., Marco Lanuzza, Rose R.D., Sangiorgi E., Tous L., Van Wichelen K., Zanuccoli M.

Fuentes:

scopus