A universal adhesive containing copper nanoparticles improves the bonding and mechanical properties of resin cement–root dentin interface: an in vitro study

Article

Abstract: The aim of this study was to evaluate the anti-MMP activity of two concentrations of copper nanopart

Palabras claves:

Copper, Metalloproteinases, Nanoleakage, Nanoparticles, push-out bond strength, Universal adhesive system

Autores:

Alejandra Núñez, Alessandro D. Loguercio, Bedoya-Ocampo J., Fernández E., Gutierrez M.F., Ñaupari-Villasante R.

Fuentes:

scopus