Modeling pattern dependencies in the micron-scale embossing of polymeric layers

Conference Object

Abstract: We describe a highly computationally efficient method for calculating the topography of a thermoplas

Palabras claves:

Hot embossing, Micro-embossing, Polymethylmethacrylate, Polysulfone, Simulation, Thermoplastic polymers

Autores:

Boning D., Iliescu C., Lam Y., Ming Ni, Taylor H.K., Xing C.

Fuentes:

scopus