Copper-Plating Metallization with Alternative Seed Layers for c-Si Solar Cells Embedding Carrier-Selective Passivating Contacts

Article

Abstract: In this article, we develop in parallel two fabrication methods for copper (Cu) electroplated contac

Palabras claves:

Photovoltaic (PV), Photovoltaic cells, PV process control, Si PV device fabrication

Autores:

De Groot Y., Isabella O., Limodio G., Mazzarella L., Paul Procel, Van Kuler G., Yang G., Zeman M., Zhao Y.

Fuentes:

scopus