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2016 Electronics Goes Green 2016+, EGG 2016(1)
CIRP Annals - Manufacturing Technology(1)
International Journal of Advanced Manufacturing Technology(1)
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Proceedings - 12th International Conference on Intelligent Environments, IE 2016(1)
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Ciencias de la computación(2)
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Combining occupancy user profiles in a multi-user environment: An academic office case study
Conference ObjectAbstract: In a worldwide context, space heating is the largest energy consumer in commercial buildings, it accPalabras claves:multi-user environment, Occupancy pbkp_rediction, Smart thermostat, user profileAutores:Andrés Auquilla, Andrés Vinicio Auquilla Sangolqui, De Bock Y., Duflou J.R., Nowé A.Fuentes:rraaescopusIntelligent occupancy-driven thermostat by dynamic user profiling
Conference ObjectAbstract: Matching system functionality and user needs by learning from user behaviour enables a significant rPalabras claves:Autores:Andrés Auquilla, Andrés Vinicio Auquilla Sangolqui, De Bock Y., Duflou J.R., Kellens K., Nowé A.Fuentes:rraaescopusImpact reduction potential by usage anticipation under comfort trade-off conditions
ArticleAbstract: Well-optimized intelligent control of products and systems with a substantial energy and/or consumabPalabras claves:Energy efficiency, pattern recognition, Usage patternsAutores:Andrés Auquilla, Andrés Vinicio Auquilla Sangolqui, De Bock Y., Duflou J.R., Kellens K., Nowé A.Fuentes:rraaescopusPressure-sensitive fasteners for active disassembly
ArticleAbstract: This paper presents a number of novel active fasteners developed to significantly lower disassemblyPalabras claves:Active disassembly, Active fastener design, Automated disassembly, Closed-cell elastomer foam, Design for disassemblyAutores:Devoldere T., Dewulf W., Duflou J.R., Paul Vanegas, Peeters J.R., Van den Bossche W.Fuentes:scopusTool Design for Electronic Product Dismantling
Conference ObjectAbstract: In industrialized countries, waste electrical and electronic equipment is mostly processed in shreddPalabras claves:Disassembly, Dismantling, recycling, WEEEAutores:Dewulf W., Duflou J.R., Mouton C., Paul Vanegas, Peeters J.R.Fuentes:rraaescopus