Product size distribution function influence on interpolation calculations in the Bond ball mill grindability test

Review

Abstract: Bond standard procedures are often used in design of comminution circuits, especially in the case of

Palabras claves:

Ball mills, Bond standard test, Grindability, Power consumption, Work index

Autores:

García G.G., J. M. Menéndez-Aguado, Rodríguez B.A., Velázquez A.L.C.

Fuentes:

scopus