Mostrando 5 resultados de: 5
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Metals(2)
International Journal of Mineral Processing(1)
Minerals and Metallurgical Processing(1)
Transactions of the Institutions of Mining and Metallurgy, Section C: Mineral Processing and Extractive Metallurgy(1)
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Ingeniería y operaciones afines(4)
Geología económica(2)
Fabricación de productos para usos específicos(1)
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scopus(5)
Grinding kinetics study of tungsten ore
ArticleAbstract: The European Commission (EC) maintains the consideration of tungsten as a critical raw material forPalabras claves:Critical Raw Materials, Grinding kinetics, Tungsten oreAutores:J. M. Menéndez-Aguado, Nava J.V., Velázquez A.L.C.Fuentes:scopusToward determining the behavior of fragmentation functions during the impact crushing of minerals
ArticleAbstract: The subject of this paper is particle population balance models (PBM) that describe mineral impact cPalabras claves:fragmentation, Impact crushing, Modeling and simulationAutores:Hechavarría-Pérez J.R., J. M. Menéndez-Aguado, Rodríguez B.A., Sánchez A.B., Velázquez A.L.C.Fuentes:scopusVariability of the ball mill bond’s standard test in a ta ore due to the lack of standardization
ArticleAbstract: There is no doubt about the practical interest of Fred Bond’s methodology in the field of comminutioPalabras claves:Comminution, Energy efficiency, Grindability, Work indexAutores:García G.G., J. M. Menéndez-Aguado, Pérez B.F., Velázquez A.L.C.Fuentes:scopusProcess models for simulation of Bond tests
ArticleAbstract: In the present paper, some calculation methodologies applied to the simulation of Bond test in grindPalabras claves:Comminution, Grindability, Grinding models, Grinding simulation, Work indexAutores:Díaz M.A.R., Dzioba B.R., J. M. Menéndez-Aguado, Velázquez A.L.C.Fuentes:scopusProduct size distribution function influence on interpolation calculations in the Bond ball mill grindability test
ReviewAbstract: Bond standard procedures are often used in design of comminution circuits, especially in the case ofPalabras claves:Ball mills, Bond standard test, Grindability, Power consumption, Work indexAutores:García G.G., J. M. Menéndez-Aguado, Rodríguez B.A., Velázquez A.L.C.Fuentes:scopus