Heat transfer intensification by surface structuration in spray cooling

Conference Object

Abstract: The requirements for heat dissipation on electronic components keep growing. Cooling technologies ha

Palabras claves:

Electronic cooling, heat transfer enhancement, Two-phase flow, Wall structuration

Autores:

Caney N., Cherief W., Gruss J.A., Madrid-Lozano F., María Cristina Riofrío Riofrío

Fuentes:

scopus