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Journal of the Mechanical Behavior of Biomedical Materials(2)
International Journal of Adhesion and Adhesives(1)
Journal of Adhesion Science and Technology(1)
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scopus(5)
Biological, mechanical and adhesive properties of universal adhesives containing zinc and copper nanoparticles
ArticleAbstract: Objectives: To evaluate the effect of addition of zinc oxide and copper nanoparticles (ZnO/CuNp) intPalabras claves:Copper, Microtensile bond strength and nanoleakage, Nanoparticles, Universal adhesive system, Zinc oxideAutores:Alegria-Acevedo L.F., Alessandro D. Loguercio, Andrés Dávila-Sánchez, Bermúdez J.P., Buvinic S., Farago P.V., Fernández E., Gutierrez M.F., Hernández-Moya N., Martín J., Méndez-Bauer L., Reis A.Fuentes:scopusA universal adhesive containing copper nanoparticles improves the bonding and mechanical properties of resin cement–root dentin interface: an in vitro study
ArticleAbstract: The aim of this study was to evaluate the anti-MMP activity of two concentrations of copper nanopartPalabras claves:Copper, Metalloproteinases, Nanoleakage, Nanoparticles, push-out bond strength, Universal adhesive systemAutores:Alejandra Núñez, Alessandro D. Loguercio, Bedoya-Ocampo J., Fernández E., Gutierrez M.F., Ñaupari-Villasante R.Fuentes:scopusA universal adhesive containing copper nanoparticles improves the stability of hybrid layer in a cariogenic oral environment: An in situ study
ArticleAbstract: Purpose: To evaluate how incorporating copper nanoparticles (CuNp) into a universal adhesive affectsPalabras claves:Copper, IN SITU, Microtensile Bond Strength, Nanoleakage, Nanoparticles, Universal adhesive systemAutores:Alejandra Núñez, Alessandro D. Loguercio, De Paris Matos T., Gutierrez M.F., Mendez-Bauer M.L., Ñaupari-Villasante R., Pitlovanciv M., Souta M.C., Sutil E., Vidal O.Fuentes:scopusA universal dental adhesive containing copper nanoparticles stabilizes the hybrid layer in eroded dentin after 1 year
ArticleAbstract: This study evaluated the matrix metalloproteases (MMP) inhibition of the copper nanoparticles (CuNp)Palabras claves:Copper, Degree of conversion, Microtensile Bond Strength, Nanoleakage, Nanoparticles, Universal adhesive systemAutores:Alessandro D. Loguercio, Andrés Alejandro Viteri-García, De Paris Matos T., Figueredo de Siqueira F.S., Gutierrez M.F., Hanzen T.A., Hernández M., Mara de Paula A., Millán Cardenas A.F., Reis A.Fuentes:scopusZinc oxide and copper nanoparticles addition in universal adhesive systems improve interface stability on caries-affected dentin
ArticleAbstract: This study evaluated the MMP inhibition of the zinc oxide and copper nanoparticles (ZnO/CuNp), and tPalabras claves:Copper, Microtensile Bond Strength, Nanoleakage, Nanoparticles, Universal adhesive system, Zinc oxideAutores:Alegria-Acevedo L.F., Alessandro D. Loguercio, Andrés Dávila-Sánchez, Astorga J., Bermúdez J.P., Farago P.V., Fernández E., Gutierrez M.F., Hernández M., Méndez-Bauer L., Reis A.Fuentes:scopus