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A universal dental adhesive containing copper nanoparticles stabilizes the hybrid layer in eroded dentin after 1 year
ArticleAbstract: This study evaluated the matrix metalloproteases (MMP) inhibition of the copper nanoparticles (CuNp)Palabras claves:Copper, Degree of conversion, Microtensile Bond Strength, Nanoleakage, Nanoparticles, Universal adhesive systemAutores:Alessandro D. Loguercio, Andrés Alejandro Viteri-García, De Paris Matos T., Figueredo de Siqueira F.S., Gutierrez M.F., Hanzen T.A., Hernández M., Mara de Paula A., Millán Cardenas A.F., Reis A.Fuentes:scopusFour-year effects of copper-nanoparticles on durability of resin-dentin interfaces
ArticleAbstract: Objective: To evaluate the effect of the addition of copper nanoparticles (CuNp) at different concenPalabras claves:Dental bonding, durability, Hybrid layer, Micro-tensile, NanoleakageAutores:Alejandra Núñez, Alessandro D. Loguercio, Fernández E., Gutierrez M.F., Matos T.P., Ñaupari-Villasante R., Reis A.Fuentes:scopusIn vitro biological and adhesive properties of universal adhesive systems on sound and caries-affected dentine: 18 months
ArticleAbstract: The present study aims to evaluate antimicrobial activity, cytotoxicity, as well as resin-dentine miPalabras claves:Dentine, Hybrid layer, Mechanical properties of adhesives, Nanoleakage, Universal adhesive systemAutores:Alegria-Acevedo L.F., Alejandra Núñez, Alessandro D. Loguercio, Andrés Dávila-Sánchez, Buvinic S., de Souza J.J., Fernández E., Gutierrez M.F., Mendez-Bauer M.L., Ñaupari-Villasante R.Fuentes:googlescopusThe sonic application of universal adhesives in self-etch mode improves their performance on enamel
ArticleAbstract: The objective of this study was to evaluate the effect of sonic application of universal adhesives oPalabras claves:Degree of conversion, Enamel, Etch-and-rinse, Microshear bond strength, self-etch, sonic application, Universal adhesive systemsAutores:Alessandro D. Loguercio, Gutierrez M.F., Hass V., Luque-Martinez I.V., Muñoz M.A., Reis A.Fuentes:scopus