A universal adhesive containing copper nanoparticles improves the stability of hybrid layer in a cariogenic oral environment: An in situ study

Article

Abstract: Purpose: To evaluate how incorporating copper nanoparticles (CuNp) into a universal adhesive affects

Palabras claves:

Copper, IN SITU, Microtensile Bond Strength, Nanoleakage, Nanoparticles, Universal adhesive system

Autores:

Alejandra Núñez, Alessandro D. Loguercio, De Paris Matos T., Gutierrez M.F., Mendez-Bauer M.L., Ñaupari-Villasante R., Pitlovanciv M., Souta M.C., Sutil E., Vidal O.

Fuentes:

scopus