Failures of electronic devices: solder joints failure modes, causes and detection methods

Abstract:

In this chapter, we present an overview of the main failure modes of electronic devices and it focuses on the three main parts of the electronic packages: printed circuit board, integrated circuit, and solder interconnects. It presents details about the failure modes, causes, and common solder failure detection methods. The common loading conditions that are exerted on electronic packages were defined. The primary drivers of solder interconnect failures in each loading condition were thoroughly explained. A full discussion on solder failure modes and causes is also presented. Finally, common solder crack failure detection approaches are presented in detail.

Año de publicación:

2019

Keywords:

• Electronic packages
• solder joint failures
• failure detection methods
• shock and vibration reliability tests
• thermal cycling
• thermomechanical failures

Fuente:

scopus