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Heterogeneous Integration of Plasmonics with Si-Photonics & Microelectronics for High-Performance Optical Routing

Abstract:

Advanced packaging technologies impact future systems, since packaging determines functionality, cost and reliability of future systems. The future systems are very high complex systems and contain different physical functions. Therefore modularity in heterogeneous integration is required. Future systems combine optical and ultra high frequency functions. With this a large variety of materials will be applied. For all these components a common smart support substrate such as ‘Silicon’ will be of importance for future systems. Furthermore, System-in-Package is must for future subsystems in order to overcome the challenges. In tems of of today’s Peta-flop High-Performance Computing (HPC) applications the size and power consumption appear to be critical issues, signifying that new technological and architectural considerations are required in order to be able to move towards Exascale-computing powers. Whereas …