Effect of the dielectric thickness and the metal deposition technique on the mobility for HfO2/TaN NMOS devices


Abstract:

In this paper the effects from the high-κdielectric thickness and the metal gate deposition technique on the mobility of n-channel MOS transistors are investigated. The results reveal mobility degradation due to an increase of charge density in the dielectric and / or at the material interfaces, not efficiently compensated by the screening effect from the gate. We correlate this mobility degradation to the reduction observed in a comparison between metal and poly-Si gated MOSFETs. It is shown that the mobility can be improved by using different metals deposition technique, which indicates that the mobility reduction is related to the deposition technique. © 2005 Published by Elsevier B.V.

Año de publicación:

2005

Keywords:

  • High-κ metal gate MOS transistor
  • Metal deposition
  • Mobility reduction
  • Oxide thickness
  • Screening effect

Fuente:

scopusscopus

Tipo de documento:

Other

Estado:

Acceso restringido

Áreas de conocimiento:

  • Ingeniería electrónica
  • Semiconductor
  • Ingeniería electrónica

Áreas temáticas de Dewey:

  • Física aplicada
  • Electricidad y electrónica
  • Metalurgia y productos metálicos primarios
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Objetivos de Desarrollo Sostenible:

  • ODS 7: Energía asequible y no contaminante
  • ODS 11: Ciudades y comunidades sostenibles
  • ODS 9: Industria, innovación e infraestructura
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