Effect of the dielectric thickness and the metal deposition technique on the mobility for HfO2/TaN NMOS devices
Abstract:
In this paper the effects from the high-κdielectric thickness and the metal gate deposition technique on the mobility of n-channel MOS transistors are investigated. The results reveal mobility degradation due to an increase of charge density in the dielectric and / or at the material interfaces, not efficiently compensated by the screening effect from the gate. We correlate this mobility degradation to the reduction observed in a comparison between metal and poly-Si gated MOSFETs. It is shown that the mobility can be improved by using different metals deposition technique, which indicates that the mobility reduction is related to the deposition technique. © 2005 Published by Elsevier B.V.
Año de publicación:
2005
Keywords:
- High-κ metal gate MOS transistor
- Metal deposition
- Mobility reduction
- Oxide thickness
- Screening effect
Fuente:
scopusTipo de documento:
Other
Estado:
Acceso restringido
Áreas de conocimiento:
- Ingeniería electrónica
- Semiconductor
- Ingeniería electrónica
Áreas temáticas de Dewey:
- Física aplicada
- Electricidad y electrónica
- Metalurgia y productos metálicos primarios
Objetivos de Desarrollo Sostenible:
- ODS 7: Energía asequible y no contaminante
- ODS 11: Ciudades y comunidades sostenibles
- ODS 9: Industria, innovación e infraestructura