Kinetics of buffer-related RON-increase in gan-on-silicon mis-hemts


Abstract:

This letter reports an extensive analysis of the charge capture transients induced by OFF-state bias in double heterostructure AlGaN/GaN MIS- high electron mobility transistor grown on silicon substrate. The exposure to OFF-state bias induces a significant increase in the ON-resistance (Ron) of the devices. Thanks to time-resolved on-the-fly analysis of the trapping kinetics, we demonstrate the following relevant results: 1) Ron-increase is temperature- and field-dependent, hence can significantly limit the dynamic performance of the devices at relatively high-voltage and high temperature (100°C-140°C) operative conditions; 2) the comparison between OFF-state and back-gating stress indicates that the major contribution to the Ron-increase is due to the trapping of electrons in the buffer, and not at the surface; 3) the observed exponential kinetics suggests the involvement of point-defects, featuring thermally activated capture cross section; and 4) trapping-rate is correlated with buffer vertical leakage-current and is almost independent to gatedrain length.

Año de publicación:

2014

Keywords:

  • Current collapse
  • Dynamic RON
  • GaN
  • HEMT
  • TEMPERATURE
  • TRAPPING

Fuente:

scopusscopus

Tipo de documento:

Article

Estado:

Acceso restringido

Áreas de conocimiento:

  • Semiconductor
  • Ingeniería electrónica
  • Ingeniería electrónica

Áreas temáticas de Dewey:

  • Física aplicada
  • Electricidad y electrónica
  • Ingeniería y operaciones afines
Procesado con IAProcesado con IA

Objetivos de Desarrollo Sostenible:

  • ODS 7: Energía asequible y no contaminante
  • ODS 12: Producción y consumo responsables
  • ODS 9: Industria, innovación e infraestructura
Procesado con IAProcesado con IA