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Origen: "scopus"
Subtipo de publicación
Book Part
(1)
Publisher
Handbook of Materials Failure Analysis: With Case Studies from the Electronic and Textile Industries
(1)
Área temáticas
Física aplicada
(1)
Área de conocimiento
Ingeniería electrónica
(1)
Año de Publicación
2019
(1)
Palabras Claves
Electronic packages
(1)
failure detection methods
(1)
shock and vibration reliability tests
(1)
solder joint failures
(1)
thermal cycling
(1)
Ver más
Failures of electronic devices: solder joints failure modes, causes and detection methods
Book Part
Abstract:
In this chapter, we present an overview of the main failure modes of electronic devices and it focus
Palabras claves:
Electronic packages, failure detection methods, shock and vibration reliability tests, solder joint failures, thermal cycling, thermomechanical failures
Autores:
Abdel Salam Hamdy Makhlouf, Gharaibeh M.A.
Fuentes:
scopus
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