Mostrando 10 resultados de: 20
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Solid-State Electronics(3)
IEEE Transactions on Device and Materials Reliability(2)
IEEE Transactions on Electron Devices(2)
Microelectronic Engineering(2)
2018 IEEE 3rd Ecuador Technical Chapters Meeting, ETCM 2018(1)
Characterization and Modeling of BTI in SiC MOSFETs
Conference ObjectAbstract: SiC power MOSFETs have been investigated by performing two different kinds of measurements, the hystPalabras claves:Autores:Consentino G., Cornigli D., Crupi F., Fiegna C., Reggiani S., Sánchez Luis, Sangiorgi E., Tallarico A.N., Valdivieso C.Fuentes:scopusA Defect-Centric Analysis of the Temperature Dependence of the Channel Hot Carrier Degradation in nMOSFETs
ArticleAbstract: The defect-centric distribution is used to study the temperature dependence of channel hot carrier (Palabras claves:channel hot carrier degradation, defect-centric distribution, temperature analysisAutores:Crupi F., Franco J., Kaczer B., Luis Miguel Prócel Moya, Trojman L.Fuentes:googlescopusA Defect-Centric perspective on channel hot carrier variability in nMOSFETs
ArticleAbstract: In this work we confirm the validity of the Defect-Centric distribution for pbkp_redicting the CHC bPalabras claves:channel hot carrier degradation, defect-centric distribution, variabilityAutores:Crupi F., Franco J., Kaczer B., Luis Miguel Prócel Moya, Trojman L., Tuinhout H., Wils N.Fuentes:googlescopusDefect-centric distribution of channel hot carrier degradation in nano-MOSFETs
ArticleAbstract: The defect-centric distribution is used, for the first time, to study the channel hot carrier (CHC)Palabras claves:channel hot-carrier, defect-centric distribution, nFETAutores:Crupi F., Franco J., Kaczer B., Luis Miguel Prócel Moya, Trojman L.Fuentes:googlescopusAdjusting thermal stability in double-barrier MTJ for energy improvement in cryogenic STT-MRAMs
ArticleAbstract: This paper investigates the impact of thermal stability relaxation in double-barrier magnetic tunnelPalabras claves:77 K, Cryogenic cache, Cryogenic electronics, double-barrier magnetic tunnel junction (DMTJ), STT-MRAM, Thermal stability relaxationAutores:Crupi F., Esteban Garzón, Marco Lanuzza, Rose R.D., Teman A., Trojman L.Fuentes:scopusDesign guidelines for a metallization scheme with multiple-emitter contact lines in BC-BJ solar cells
ArticleAbstract: This work presents a study on back contact-back junction solar cells when using a metallization schePalabras claves:BC-BJ solar cells, Metallization, Photovoltaics, TCAD simulationAutores:Crupi F., Guerra N., Marco Guevara, Marco Lanuzza, Paul Procel, Rose R.D.Fuentes:scopusExploiting Double-Barrier MTJs for Energy-Efficient Nanoscaled STT-MRAMs
Conference ObjectAbstract: This paper explores performance and technology-scalability of STT-MRAMs exploiting double-barrier MTPalabras claves:double-barrier magnetic tunnel junction (DMTJ), FinFET, STT-MRAM, technology-voltage scalingAutores:Carpentieri M., Crupi F., Esteban Garzón, Finocchio G., Marco Lanuzza, Rose R.D., Trojman L.Fuentes:scopusExploiting STT-MRAMs for Cryogenic Non-Volatile Cache Applications
ArticleAbstract: This paper evaluates the potential of spin-transfer torque magnetic random-access memories (STT-MRAMPalabras claves:77 K, cache memory, cold computing, Cryogenic, STT-MRAMAutores:Crupi F., Esteban Garzón, Marco Lanuzza, Rose R.D., Teman A.Fuentes:scopusEvaluating the energy efficiency of stt-mrams based on perpendicular mtjs with double reference layers
Conference ObjectAbstract: This paper evaluates the energy efficiency of STT-MRAMs based on double-barrier MTJs (DMTJs) as compPalabras claves:Autores:Crupi F., Esteban Garzón, Marco Lanuzza, Rose R.D.Fuentes:scopusExperimental evidence of the quantum point contact theory in the conduction mechanism of bipolar HfO<inf>2</inf>-based resistive random access memories
ArticleAbstract: The quantum point contact (QPC) model for dielectric breakdown is used to explain the electron transPalabras claves:Autores:Crupi F., Degraeve R., Goux L., J. Moreno, Luis Miguel Prócel Moya, Maccaronio V., Simoen E., Trojman L.Fuentes:scopus